iTECH RF-B630T 6 Zones Hot Air Reflow Soldering Machine for SMT Line PCB Handling Machine Whole Size: L1000cm*W120cm*H180cmSingle workbench size:

Whole Size: L1000cm*W120cm*H180cmSingle workbench size: L1000cm*W60cm*H75cmFrame: 30*40mm Steel Pipe

This streamlines the production process and can lead to higher efficiency as workers can focus on components insertion job rather than transportation

industrial use

Use for single or double-side PCB

iTECH RF-B630T 6 Zones Hot Air Reflow Soldering Machine for SMT Line PCB Handling Machine Whole Size: L1000cm*W120cm*H180cmSingle workbench size:6 ZONES 1060MM REFLOW MACHINE FOR PCB SOLDERING PROCESS The RF B630T inline reflow oven is configured with 6 heating zones followed by cooling section(s). During the SMT reflow soldering process, the zones are programmed with a thermal set point. This set point corresponds to the temperature the circuit board should be exposed to as it passes through that zone. The soldering process completed automatically after temperature set up. Easy to operate.